The main courses are set up around the employment positions of packaging and testing, design, application and sales. They are
Digital System Design, Integrated Circuit Testing Technology, Integrated Circuit Layout Design, Integrated Circuit Packaging
Technology, Digital IC Back- end Design, and Digital Integrated Circuit Verification.
Graduates of this major can apply for jobs related to chip design and test verification in integrated circuit technology application
companies; chip sales in multinational chip companies and trading companies; smart product hardware design, application
software development and product testing in integrated circuit companies; chip packaging, testing and quality inspection in chip
packaging testing companies
With the vigorous development of artificial intelligence (AI), smart products, and Internet of Things technology, Shenzhen's
integrated circuit design industry and smart product design industry have developed rapidly. The integrated circuit design
industry in Shenzhen accounts for more than one-third of the national integrated circuit design industry.
This major cooperates with Micro & Nano Institute and National Integrated Circuit Design Shenzhen Industrialization Base to
build a national Core Fire platform talent training base for the entire IC design process. It also co-builds the third-generation
semiconductor talent training base with Shenzhen Semiconductor Industry Association and the Third Generation Semiconductor
Industry Alliance. More than 30 off-campus training bases have been established, providing a large number of internships and
employment opportunities for graduates every year. The students of this major have participated in the vocational skill
competition and won a number of national and provincial first prizes. The graduate students have become the technical
backbone of many well-known microelectronics companies in Shenzhen. Some graduates who are engaged in chip sales have
earned a monthly income of more than 20,000 yuan and have become senior white-collars.